概要信息：

©  Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
1 Publication Order Number:
NE5532/D
NE5532, SA5532, SE5532,
NE5532A, SE5532A
Internally Compensated
Dual Low Noise
Operational Amplifier
The 5532 is a dual high-performance low noise operational
amplifier. Compared to most of the standard operational amplifiers,
such as the 1458, it shows better noise performance, improved output
drive capability and considerably higher small-signal and power
bandwidths.
This makes the device especially suitable for application in
high-quality and professional audio equipment, instrumentation and
control circuits, and telephone channel amplifiers. The op amp is
internally compensated for gains equal to one. If very low noise is of
prime importance, it is recommended that the 5532A version be used
because it has guaranteed noise voltage specifications.
Features
• Small-Signal Bandwidth: 10 MHz
• Output Drive Capability: 600 , 10 VRMS
• Input Noise Voltage: 5.0 nV Hz  (Typical)
• DC Voltage Gain: 50000
• AC Voltage Gain: 2200 at 10 kHz
• Power Bandwidth: 140 kHz
• Slew Rate: 9.0 V/s
• Large Supply Voltage Range: 3.0 to 20 V
• Compensated for Unity Gain
• Pb−Free Packages are Available
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
SOIC−8
D SUFFIX
CASE 751
PDIP−8
N SUFFIX
CASE 626
1
8
1
8
16
1
SOIC−16 WB
D SUFFIX
CASE 751G
N, D8 Packages
D Package*
*SOL and non-standard pinout.
7
6
54
3
2
1
BA
V+
OUTB
−INB
+INB
OUTA
−INA
+INA
V-
Top View
−INA
+INA
NC
V−
NC
NC
+INB
−INB
NC
NC
NC
OUTA
1
2
3
4
5
6
7
8 9
10
11
12
13
14
16
15
V+
OUTB
NC
NC
Top View
8
See general marking information in the device marking
section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
2
Figure 1. Equivalent Schematic (Each Amplifier)
+
_
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage VS 22 V
Input Voltage VIN VSUPPLY V
Differential Input Voltage (Note 1) VDIFF 0.5 V
Operating Temperature Range
NE5532/A
SA5532
SE5532/A
Tamb
0 to 70
−40 to +85
−55 to +125
°C
Storage Temperature Tstg −65 to +150 °C
Junction Temperature Tj 150 °C
Maximum Power Dissipation, Tamb = 25°C (Still-Air)
8 D8 Package
8 N Package
16 D Packagee
PD
780
1200
1200
mW
Thermal Resistance, Junction−to−Ambient
8 D8 Package
8 N Package
16 D Packagee
RJA
182
130
140
°C/W
Lead Soldering Temperature (10 sec max) Tsld 230 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input
voltage exceeds 0.6 V. Maximum current should be limited to 10 mA.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
3
DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.) (Notes 2, 3 and 4)
Characteristic Symbol Test Conditions
SE5532/A NE5532/A, SA5532
UnitMin Typ Max Min Typ Max
Offset Voltage VOS − − 0.5 2.0 − 0.5 4.0 mV
− Overtemperature − − 3.0 − − 5.0 mV
VOS/T − − 5.0 − − 5.0 − V/°C
Offset Current IOS − − − 100 − 10 150 nA
− Overtemperature − − 200 − − 200 nA
IOS/T − − 200 − − 200 − pA/°C
Input Current IB − − 200 400 − 200 800 nA
− Overtemperature − − 700 − − 1000 nA
IB/T − − 5.0 − − 5.0 − nA/°C
Supply Current ICC − − 8.0 10.5 − 8.0 16 mA
− Overtemperature − − 13 − − −
Common-Mode Input Range VCM − 12 13 − 12 13 − V
Common-Mode Rejection Ratio CMRR − 80 100 − 70 100 − dB
Power Supply Rejection Ratio PSRR − − 10 50 − 10 100 V/V
Large-Signal Voltage Gain AVOL RL  2.0 k; VO = 10 V 50 100 − 25 100 − V/mV
Overtemperature 25 − − 15 − −
RL  600 ; VO = 10 V 40 50 − 15 50 −
Overtemperature 20 − − 10 − −
Output Swing VOUT RL  600  12 13 − 12 13 − V
Overtemperature 10 12 − 10 12 −
RL  600 ; VS = 18 V 15 16 − 15 16 −
Overtemperature 12 14 − 12 14 −
RL  2.0 k 13 13.5 − 13 13.5 −
Overtemperature 12 12.5 − 10 12.5 −
Input Resistance RIN − 30 300 − 30 300 − k
Output Short Circuit Current ISC − 10 38 60 10 38 60 mA
2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input
voltage exceeds 0.6 V. Maximum current should be limited to 10 mA.
3. For operation at elevated temperature, derate packages based on the package thermal resistance.
4. Output may be shorted to ground at VS = 15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating
is not exceeded.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
4
AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.)
Characteristic Symbol Test Conditions
NE/SE5532/A, SA5532
UnitMin Typ Max
Output Resistance ROUT AV = 30 dB Closed-loop 
f = 10 kHz, RL = 600 
− 0.3 − 
Overshoot − Voltage-Follower %
VIN = 100 mVP-P − 10 −
CL = 100 pF; RL = 600 
Gain AV f = 10 kHz − 2.2 − V/mV
Gain Bandwidth Product GBW CL = 100 pF; RL = 600  − 10 − MHz
Slew Rate SR − − 9.0 − V/s
Power Bandwidth − VOUT = 10 V − 140 − kHz
VOUT = 14 V;
RL = 600 
− 100 −
VCC = 18 V
ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.)
Characteristic Symbol Test Conditions
NE/SE5532 NE/SA/SE5532A
UnitMin Typ Max Min Typ Max
Input Noise Voltage VNOISE fO = 30 Hz − 8.0 − − 8.0 12 nV/√Hz
fO = 1.0 kHz − 5.0 − − 5.0 6.0
Input Noise Current INOISE fO = 30 Hz − 2.7 − − 2.7 − pA/√Hz
fO = 1.0 kHz − 0.7 − − 0.7 −
Channel Separation − f = 1.0 kHz; RS = 5.0 k − 110 − − 110 − dB
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
5
TYPICAL PERFORMANCE CHARACTERISTICS
G
A
IN
 (
d
B
)
G
A
IN
 (
d
B
)
10 102 103 104 105 106 107
120
80
40
0
-40
f (Hz)
80
60
40
20
0
-55 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125
1,4
1,2
0,8
0,4
0
30
20
10
0
0 10 20
Tamb (oC)
TYP
IO
(mA)
II
(mA)
VIN (V)
Vp; −VN (V)
Figure 2. Open-Loop Frequency
Response
60
40
20
0
-20
103 104 105 106 107 108
f (Hz)
RF = 10 k; RE = 100 
RF = 9 k; RE = 1 k
RF = 1 k; RE = ∞
102 103 104 105 106 107
40
30
20
10
0
f (Hz)
(V)
Vo(p-p)
(nV Hz )
IO = 0
0 10 20
0
2
4
6
10−2
10
1
10−1
10−2
10 102 103 104
f (Hz)
TYP
TYP
IP
IN
(mA)
Vp; −VN (V)
Tamb (oC)
Figure 3. Closed-Loop Frequency
Response
Figure 4. Large−Signal Frequency
Response
Figure 5. Output Short−Circuit
Current
Figure 6. Input Bias Current Figure 7. Input Common−Mode
Voltage Range
Figure 8. Supply Current Figure 9. Input Noise Voltage
Density
TYPICAL VALUES
TYPICAL VALUES
VS = 15 V
TYPICAL VALUES
VS = 15 V VS = 15 V TYPICAL VALUES
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
6
Closed-Loop Frequency Response Voltage-Follower
+
−
5532 (1/2)
100 pF
RS
VI RE
RF
800 
25 
+
−
5532
VIN
VOUT
100 pF
600 
V+
V−
1 k
Figure 10. Test Circuits
MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
PDIP−8
N SUFFIX
CASE 626
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or  = Pb−Free Packagee
NE5532AN
AWL
YYWWG
NE5532N
AWL
YYWWG
SA5532N
AWL
YYWWG
SE5532N
AWL
YYWWG
SOIC−16 WB
D SUFFIX
CASE 751G
16
1
NE5532D
AWLYYWWG
S5532
ALYWA
 
1
8
N5532
ALYW
 
1
8
N5532
ALYWA
 
1
8
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
7
ORDERING INFORMATION
Device Description Temperature Range Shipping†
NE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail
NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
0 to 70°C 98 Units / Rail
NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel
NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
0 to 70°C 2500 / Tape & Reel
NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail
NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) 
(Pb−Free)
0 to 70°C 50 Units / Rail
NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 47 Units / Rail
NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package 
(Pb−Free)
0 to 70°C 47 Units / Rail
NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 1000 Tape & Reel
NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package 
(Pb−Free)
0 to 70°C 1000 Tape & Reel
NE5532D8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail
NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
0 to 70°C 98 Units / Rail
NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel
NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
0 to 70°C 2500 / Tape & Reel
NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail
NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) 
(Pb−Free)
0 to 70°C 50 Units / Rail
SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail
SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) 
(Pb−Free)
−40 to +85°C 50 Units / Rail
SE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 98 Units / Rail
SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
−55 to +125°C 98 Units / Rail
SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 2500 / Tape & Reel
SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package 
(Pb−Free)
−55 to +125°C 2500 / Tape & Reel
SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C 50 Units / Rail
SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) 
(Pb−Free)
−55 to +125°C 50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
SEATING
PLANE
1
4
58
N
J
X 45
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B S
DH
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0  8  0  8  
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
MYM0.25 (0.010)
−Z−
YM0.25 (0.010) Z S X S
M
   
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
 mm
inches
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
9
PACKAGE DIMENSIONS
8−Pin Plastic Dual In−Line Package (PDIP−8)
N SUFFIX
CASE 626−05
ISSUE L NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1 4
58
F
NOTE 2 −A−
−B−
−T−
SEATING
PLANE
H
J
G
D K
N
C
L
M
MAM0.13 (0.005) B MT
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
M −−− 10  −−− 10  
N 0.76 1.01 0.030 0.040
 
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
10
PACKAGE DIMENSIONS
SOIC−16 WB
D SUFFIX
CASE 751G−03
ISSUE C
D
14X
B16X
SEATING
PLANE
SAM0.25 B ST
16 9
81
h
X
 4
5 
M
B
M
0.
25
H
8X
E
B
A
e
TA
1
A
L
C

NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0  7  
ON Semiconductor and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries,  affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
NE5532/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.